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Overmolding Full Molding Packaging
Product Introduction

A common packaging form are seen in consumer and industrial products, with good air-tightness , reliability and  highly cost-effectiveness, so this process are familiar with semiconductor industry.


Technical advantages

① Highly cost-effectiveness, high reliabilit which can pass MSL level 3 testing easily;

② Strip or single can be choosen for shipment with high production efficiency;

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